| Product | UF-2030T2-2 |
|---|---|
| Application | Underfill for BGA/CSP/WL-CSP |
| Recommended Cure Condition | Convection Oven 20m @ 140°C |
| Viscosity | 1,100 cps |
| File | |
| Description | Reworkable, Very low viscosity, Fast Flow |
| Product | UF-2030T2-2 |
|---|---|
| Application | Underfill for BGA/CSP/WL-CSP |
| Recommended Cure Condition | Convection Oven 20m @ 140°C |
| Viscosity | 1,100 cps |
| File | |
| Description | Reworkable, Very low viscosity, Fast Flow |