About Company
EICT Message
Milestone
Company Profile
Means of Al
Vision
Management Philosophy
Certificate
Distribution Network
Product
Product
Adhesive
Die Attach
UV Photonic
UC/UT Series
Underfill
Electronic Adhesive
E-Catalogue
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News&Notice
Location
Sample state
Video
CONTACT
CONTACT US
약관 및 정책
이용약관
개인정보처리방침
이메일무단수집거부
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Product
Product
Product
Product
FL-5065
Application
Liguid Encapsulant
Recommended Cure Condition
Convection Oven 15m @ 100°C
Viscosity
35,000 cps
File
Description
High reliability, High Tg