About Company
EICT Message
Milestone
Company Profile
Means of Al
Vision
Management Philosophy
Certificate
Distribution Network
Product
Product
Adhesive
Die Attach
UV Photonic
UC/UT Series
Underfill
Electronic Adhesive
E-Catalogue
Community
News&Notice
Location
Sample state
Video
CONTACT
CONTACT US
약관 및 정책
이용약관
개인정보처리방침
이메일무단수집거부
eng
chn
Product
Product
Product
Product
IB-7700F
Application
Sealing / Bonding
Recommended Cure Condition
Convection Oven 30m @ 100°C
Viscosity
260,000 cps
File
Description
Good adhesion, Low CTE