About Company
EICT Message
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Company Profile
Means of Al
Vision
Management Philosophy
Certificate
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Product
Product
Adhesive
Die Attach
UV Photonic
UC/UT Series
Underfill
Electronic Adhesive
E-Catalogue
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Sample state
Video
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약관 및 정책
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개인정보처리방침
이메일무단수집거부
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Product
Product
Product
Product
BA-1603
Application
B-stage DA for Semicon PKG
Recommended Cure Condition
B-stage cure : 30m @ 125°C + Post cure : 30m @ 175°C
Viscosity
27,000 cps
File
Description
High reliability