| Product | CB-6506 |
|---|---|
| Application | Chip bonding adhesive |
| Recommended Cure Condition | Reflow Oven 80s @ 150℃ |
| Viscosity | 150,000 cps |
| File |
MATT CB-6506 TDS_Rev.B.pdf MATT CB-6506 MSDS ENG_Rev.E.pdf |
| Description | Good dispensing workability |
| Product | CB-6506 |
|---|---|
| Application | Chip bonding adhesive |
| Recommended Cure Condition | Reflow Oven 80s @ 150℃ |
| Viscosity | 150,000 cps |
| File |
MATT CB-6506 TDS_Rev.B.pdf MATT CB-6506 MSDS ENG_Rev.E.pdf |
| Description | Good dispensing workability |