| Product | CB-6520 |
|---|---|
| Application | Chip bonding adhesive |
| Recommended Cure Condition | Reflow Oven 4m @ 150℃ or Hot Plate 90s @ 150℃ |
| Viscosity | 100,000 cps |
| File |
MATT CB-6520 TDS_Rev.D.pdf MATT CB-6520 MSDS ENG_Rev.E.pdf |
| Description | Good dispensing workability |