| Product | CB-6590 |
|---|---|
| Application | Chip bonding adhesive |
| Recommended Cure Condition | Reflow Oven 90s @ 150℃ |
| Viscosity | 115,000 cps |
| File | |
| Description | Good dispensing workability, High Tg |
| Product | CB-6590 |
|---|---|
| Application | Chip bonding adhesive |
| Recommended Cure Condition | Reflow Oven 90s @ 150℃ |
| Viscosity | 115,000 cps |
| File | |
| Description | Good dispensing workability, High Tg |