| Product | CB-6520P |
|---|---|
| Application | Chip bonding adhesive |
| Recommended Cure Condition | Reflow Oven 90s @ 150℃ |
| Viscosity | 145,000 cps |
| File |
MATT CB-6520P MSDS ENG_Rev.A.pdf MATT CB-6520P MSDS ENG_Rev.A.pdf |
| Description | Good screen printing workability, High Tg |