| Product | UV-3200 |
|---|---|
| Application | Coner bonding for BGA/CSP |
| Recommended Cure Condition | 365nm LED 3,000mJ |
| Viscosity | 16,000 cps |
| File |
MATT UV-3200 TDS_Rev.B.pdf MATT UV-3200 MSDS ENG_Rev.F.pdf |
| Description | Low volume cure shrinkage, High adhesion with PCB |