| Product | DA-4100(S25) |
|---|---|
| Application | Image sensor die attach bonding |
| Recommended Cure Condition | Hot Plate 2m @ 120℃ |
| Viscosity | 2,400 cps (100prm) |
| File | |
| Description | Self leveling, Low Warpage with 25㎛ polymer spacer |
| Product | DA-4100(S25) |
|---|---|
| Application | Image sensor die attach bonding |
| Recommended Cure Condition | Hot Plate 2m @ 120℃ |
| Viscosity | 2,400 cps (100prm) |
| File | |
| Description | Self leveling, Low Warpage with 25㎛ polymer spacer |