About Company
EICT Message
Milestone
Company Profile
Means of Al
Vision
Management Philosophy
Certificate
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Product
Product
Adhesive
Die Attach
UV Photonic
UC/UT Series
Underfill
Electronic Adhesive
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Sample state
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CONTACT US
약관 및 정책
이용약관
개인정보처리방침
이메일무단수집거부
eng
chn
Product
Product
Product
Product
DA-4057
Application
Image sensor die attach bonding
Recommended Cure Condition
Hot Plate 2m @ 100℃
Viscosity
8,600 cps
File
Description
Low RBO of DA-4051L