About Company
EICT Message
Milestone
Company Profile
Means of Al
Vision
Management Philosophy
Certificate
Distribution Network
Product
Product
Adhesive
Die Attach
UV Photonic
UC/UT Series
Underfill
Electronic Adhesive
E-Catalogue
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News&Notice
Location
Sample state
Video
CONTACT
CONTACT US
약관 및 정책
이용약관
개인정보처리방침
이메일무단수집거부
eng
chn
Product
Product
Product
Product
UT-5500
Application
Active alignment
Recommended Cure Condition
365nm LED 3,000mJ + Convection Oven 60m @ 80℃
Viscosity
41,000 cps
File
Description
High adhesion with PA and PC, Low volume cure shrinkage