Product	Application	Viscosity@25'c	TI	Recommended Cure Condition	TDS	MSDS
BA-1603	B-stage DA for Semicon PKG	27,000 cps	3.5	B-stage cure : 30m @ 125°C + Post cure : 30m @ 175°C	File1	File2
BA-1604B	B-stage DA for Semicon PKG	13,000 cps	3.5	B-stage cure : 30m @ 125°C + Post cure : 30m @ 175°C	File1	File2
AD-1620	Microspeaker bonding	67,000 cps	5.3	Convection Oven 30m @ 80℃ or Hot Plate 2m @ 120℃	File1	File2
CB-6506	Chip bonding adhesive	150,000 cps	5.3	Reflow Oven 80s @ 150℃	File1	File2
CB-6520	Chip bonding adhesive	150,000 cps	7.0	Reflow Oven 4m @ 150℃ or Hot Plate 90s @ 150℃	File1	File2
CB-6590	Chip bonding adhesive	115,000 cps	6.4	Reflow Oven 90s @ 150℃	File1	File2
CB-6520P	Chip bonding adhesive	145,000 cps	5.3	Reflow Oven 90s @ 150℃	File1	File2
UV-3083H	Bonding / Sealing for OLED panel	400 cps	1.0	365nm LED 3,000mJ	File1	File2
UV-3083V	Bonding / Sealing for OLED panel	220 cps	1.0	365nm LED 3,000mJ	File1	File2
UV-3231C	Bonding / Sealing for OLED panel	500 cps	1.0	365nm LED 3,000mJ	File1	File2
UV-3231LB	Bonding / Sealing for LCD panel	760 cps	1.0	365nm LED 3,000mJ	File1	File2
UV-6103	Bonding / Sealing for LCD panel	2,700 cps	1.1	365nm LED 3,000mJ	File1	File2
UV-6103M	Bonding / Sealing for LCD panel	2,300 cps	1.0	365nm LED 3,000mJ	File1	File2
UV-6109W	Bonding / Sealing for LCD panel	7,600 cps	1.7	365nm LED 3,000mJ	File1	File2
UC-3232	Gap filling for LCD panel	600 cps	1.0	365nm LED 3,000mJ	File1	File2