| Product | DA-4001F |
|---|---|
| Application | Image sensor die attach bonding |
| Recommended Cure Condition | Convection Oven 5m @ 150℃ or Hot Plate 2m @ 120℃ |
| Viscosity | 20,000 cps |
| File |
MATT DA-4001F TDS_Rev.A.pdf MATT DA-4001F MSDS CHN_Rev.D.pdf |
| Description | High modulus, Good Adhesion |