| Product | DA-4001M |
|---|---|
| Application | Image sensor die attach bonding |
| Recommended Cure Condition | Convection Oven 10m @ 150℃ or Hot Plate 2m @ 120℃ |
| Viscosity | 38,000 cps |
| File |
MATT DA-4001M TDS CHN_Rev.C.pdf MATT DA-4001M MSDS CHN_Rev.F.pdf |
| Description | Low tilt |