Product | DA-4055 |
---|---|
Application | Image sensor die attach bonding |
Recommended Cure Condition | Hot Plate 2m @ 100℃ |
Viscosity | 37,000 cps |
File |
MATT DA-4055 TDS_Rev.A.pdf MATT DA-4055 MSDS CHN_Rev.A.pdf |
Description | Fast curable, Low warpage, Low Tilt |