| Product | UF-1083 |
|---|---|
| Application | Underfill for BGA/CSP/WL-CSP |
| Recommended Cure Condition | Convection Oven 30m @ 95℃ or Convection Oven 15m @ 125℃ or Reflow Oven 5m @ 150℃ |
| Viscosity | 1,300 cps (20rpm) |
| File |
MATT UF-1083 TDS_Rev.C.pdf MATT UF-1083 MSDS CHN_Rev.F.pdf |
| Description | Low temperature curable |