| Product | UFC-2803 |
|---|---|
| Application | Underfill for Flipchip package |
| Recommended Cure Condition | Convection Oven 10m @ 165°C |
| Viscosity | 11,000 cps |
| File | |
| Description | High reliability, High Tg, Fast Flow |
| Product | UFC-2803 |
|---|---|
| Application | Underfill for Flipchip package |
| Recommended Cure Condition | Convection Oven 10m @ 165°C |
| Viscosity | 11,000 cps |
| File | |
| Description | High reliability, High Tg, Fast Flow |