| Product | UV-3200W |
|---|---|
| Application | Coner bonding for BGA/CSP |
| Recommended Cure Condition | 365nm LED 3,000mJ |
| Viscosity | 18,000 cps |
| File |
GENESIS UV-3200W TDS CHN_Rev.A.pdf GENESIS UV-3200W MSDS CHN_Rev.B.pdf |
| Description | White color, Low volume cure shrinkage, High adhesion with PCB |