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胶黏剂
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胶黏剂
芯片粘接
紫外光产品
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电子胶黏剂
Product
Application
Viscosity@25'c
TI
Recommended Cure Condition
TDS
MSDS
AD-1331FL
Housing assembly bonding
7,300 cps
4.2
Convection Oven 20m @ 60℃ or Hot Plate 40s @ 120℃
File1
File2
AD-1331FL(S)
Housing assembly bonding
6,500 cps
4.3
Convection Oven 30m @ 80℃ or Hot Plate 30s @ 120℃
File1
File2
AD-1335
Housing assembly bonding
25,000 cps
6.0
Convection Oven 20m @ 60℃ or Hot Plate 3m @ 100℃
File1
File2
AD-1350
Housing assembly bonding
20,000 cps
3.0
Convection Oven 40m @ 80℃
File1
File2
AD-1363H
Housing assembly bonding
38,000 cps
6.5
Convection Oven 30m @ 85℃ or Hot Plate 40s @ 120℃
File1
File2
AD-1363HF
Housing assembly bonding
26,000 cps
5.8
Convection Oven 30m @ 80℃ or Hot Plate 30s @ 120℃
File1
File2
AD-1363PCH
Housing assembly bonding
25,000 cps
2.9
Convection Oven 60m @ 60℃ or Convection Oven 30m @ 85℃
File1
File2
AD-1384
Housing assembly bonding
17,000 cps
6.8
Convection Oven 30m @ 80℃ or Hot Plate 5m @ 80℃
File1
File2
AD-1363L
Shutter assembly bonding
14,000 cps
5.0
Convection Oven 30m @ 80℃ or Hot Plate 5m @ 80℃
File1
File2
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